NI舉行NI技術(shù)巔峰周　與會人員多是工業(yè)領(lǐng)域和學(xué)術(shù)界專家 　　峰會包括的內(nèi)容: 圖形系統(tǒng)設(shè)計，RF和無線通信，聲音振動和視覺系統(tǒng) 　　2007年6月19日，NI宣布2007年NI技術(shù)周的主題是：四場關(guān)于圖形化系統(tǒng)設(shè)計峰會，RF和無線通信，聲音與振動和視覺系統(tǒng)，也是公司第十三屆用戶和技術(shù)年度討論會。峰會主要特點：闡述關(guān)鍵性提示，產(chǎn)品技術(shù)培訓(xùn)和NI開發(fā)者和工業(yè)領(lǐng)先研究者的現(xiàn)場示范。與會者可以在相應(yīng)的展會亭子里觀看峰會內(nèi)容的現(xiàn)場示范。 　　圖形系統(tǒng)設(shè)計峰會，由英特爾和CMPMedia主辦，來自工業(yè)領(lǐng)域和學(xué)術(shù)界的專家們以包括來自英特爾的，Rensselaer Polytechnic學(xué)院和Max Planck學(xué)院的專家。在峰會上，技術(shù)專家會與大家一起分享富有經(jīng)驗的設(shè)計家的經(jīng)驗之談，以及沒有編程知識的控制專家利用最新技術(shù)駕馭嵌入式設(shè)計程序。參與者可以學(xué)習(xí)通過高級圖形工具和靈活的成型平臺怎樣使嵌入式設(shè)計更具流線型。研討會的主題包括：設(shè)計平臺的商業(yè)影響，運(yùn)算工程，機(jī)械電子和嵌入式設(shè)計個案研究。圖形設(shè)計系統(tǒng)峰會的看點是將會有許多工業(yè)領(lǐng)域內(nèi)有經(jīng)驗的嵌入式專家和初學(xué)者參與，包括生物醫(yī)學(xué)，研究方面，機(jī)械設(shè)計，工業(yè)自動化方面。 在RF和無線通信峰會上，有來自飛思卡爾半導(dǎo)體公司，圣地亞哥加州大學(xué)和Wi-Fi聯(lián)盟的專家，共同檢查RF及無線通信技術(shù)的最新產(chǎn)品。此峰會是特地為RF領(lǐng)域、無線電通信系統(tǒng)的專家和初學(xué)者設(shè)計的。峰會主題包括：軟件無線電、無線電發(fā)展趨勢、可配置測試架構(gòu)和無線電設(shè)備產(chǎn)品的優(yōu)化測試。IEEE通信社會/信號處理學(xué)會無線電網(wǎng)絡(luò)座談會將會在8月8號持續(xù)一天。 聲音振動和視覺系統(tǒng)峰會，有來自波音、SIRIUS Satellite Radio公司和Cincinnati大學(xué)的專家們參加。工作在工業(yè)振動、自動化噪音污染、振動和聲振粗糙度、音頻和電聲學(xué)設(shè)計的工程師們可參加由工業(yè)領(lǐng)域和學(xué)術(shù)界專家以及從事于現(xiàn)場工作的專家們共同討論的最新的聲音振動分析技術(shù)。討論會主題包括：辨認(rèn)聲音的擴(kuò)音器陣列、聲強(qiáng)測量和分析、聲振傳感器校準(zhǔn)技術(shù)、預(yù)測維護(hù)技術(shù)和多頻聲分析的音頻加速度測試。 工程師們在視覺系統(tǒng)峰會上可以參與交互式討論，涉及的主題包括快速流動成像和傳感器技術(shù)。峰會的特點是現(xiàn)場操作問題的討論如完成系統(tǒng)，其涉及照明、軟件和機(jī)器設(shè)備的其它方面。參與峰會的專家有來自Edmund Optics, Basler, FLIR 和索尼公司的專家。討論會主題包括邊緣探測技術(shù)，工業(yè)前景展望，GigE vision在縱向和橫向方面辨識。 更多關(guān)于NI技術(shù)峰會周信息可登錄：www.ni.com/niweek/summits.htm. original text [COLOR=#708090]National Instruments Hosts NIWeek Technical Summits Featuring Experts From Industry and Academia Summits Include Graphical System Design; RF and Wireless Communications; Sound and Vibration; Vision NEWS RELEASE – June 19, 2007 – National Instruments today announced four technical summits on graphical system design; RF and wireless communications; sound and vibration; and vision to take place at NIWeek 2007, the company’s 13th annual customer and technology conference. The summits feature targeted keynotes, product technical training and demonstrations by NI developers and industry-leading researchers. Attendees can see demonstrations of the summit content on the exhibition floor at corresponding pavilions. The Graphical System Design Summit, sponsored by Intel and CMP Media, welcomes experts from industry and academia, including Intel, Rensselaer Polytechnic Institute and the Max Planck Institute. At the summit, technology experts share ways experienced embedded designers and domain experts without programming knowledge can take advantage of the latest technologies driving embedded design. Attendees can learn how to streamline embedded development through high-level graphical tools and flexible prototyping platforms. Session topics include the business impact of design platform, algorithm engineering, mechatronics and embedded design case studies. The Graphical System Design Summit benefits experienced and novice embedded developers in a wide variety of industries – including biomedical, research, machine design, industrial and automotive. At the RF and Wireless Communications Summit, industry experts from Freescale Semiconductor, the University of California at San Diego and the Wi-Fi Alliance examine the latest advances in development tools for RF, wireless and communications products. The summit is designed for novice and experienced RF engineers, as well as communications and wireless systems engineers. Session topics include software-defined radio, emerging trends in wireless, reconfigurable test architectures and production test optimization of wireless devices. The IEEE Communications Society/Signal Processing Society’s Wireless Hive Network Symposium will also take place all day Wednesday, Aug. 8, during the summit. The Sound and Vibration Summit features experts from Boeing, SIRIUS Satellite Radio and the University of Cincinnati. Engineers working in industrial vibration; automotive noise, vibration and harshness （NVH）; and audio and electroacoustics design can attend presentations by industry and academia experts as well as hands-on workshops featuring the latest sound and vibration analysis techniques. Session topics include microphone arrays for noise identification; sound intensity measurement and analysis; sound and vibration sensor calibration techniques; advances in prognostics for predictive maintenance; and audio test acceleration with multitone analysis. Engineers at the Vision Summit can participate in interactive presentations covering topics such as high-speed image streaming and sensor technologies. The summit features hands-on workshops on subjects such as “Completing the System,” which covers lighting, optics, software and other facets of machine vision. The summit features experts from Edmund Optics, Basler, FLIR and Sony. Session topics include new edge-detection methods, a vision industry outlook, GigE vision in-depth and direct part mark identification. Readers can learn more about the NIWeek technical summits by visiting www.ni.com/niweek/summits.htm.[/COLOR]